Gas distribution system

Details Gas distribution system Gas distribution system

1993-08-17

1995-10-17

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

1566401, 1566461, 118715, B05C 500

Patent

active

054587255

ABSTRACT:
An improved gas distribution system (10) is provided. The system reduces the number of particles settling on semiconductor wafers (38, 40, 42) during processing. The system includes gas tubes (44, 46,48, 50) having gas inlets (52, 54, 56, 58, 60, 62). The gas inlets are offset from the center line (74, 76) of corresponding wafers, and offset from the inlets of neighboring gas tubes. The inlets are also directed along lines (90, 92, 94, 96) which do not intersect corresponding wafers (38, 40, 42). The gas tubes (44, 46,48, 50) each include a removable cap (110) to provide easy cleaning. Additionally, the gas tubes (44, 46,48, 50) each include an alignment slot (114) for accurate alignment of the tube and inlets.

REFERENCES:
patent: 5211825 (1993-05-01), Saito et al.
The Precision Etch 8300/8300A Process Chamber Module Study Guide, 1987 Applied Materials, pp. 30-32.

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