Gas discharge apparatus for wafer etching systems

Details Gas discharge apparatus for wafer etching systems Gas discharge apparatus for wafer etching systems

1998-08-14

2000-05-16

Bueker, Richard

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118723E, 118715, C23C 1600

Patent

active

060632356

ABSTRACT:
A novel gas discharge apparatus for use in a plasma etching system is disclosed. Several components of the gas discharge apparatus including the annular outer chimney, annular outer chimney clamp and annular insulator collar are modified to allow increased egress of particulate matter generated by the etching process away from the substrate being figured. This increased egress results in a significant reduction of contaminants contacting the substrate surface.

REFERENCES:
patent: 4612077 (1986-09-01), Tracy et al.
patent: 5266153 (1993-11-01), Thomas
patent: 5372674 (1994-12-01), Steinberg
patent: 5391252 (1995-02-01), Taylor
patent: 5515167 (1996-05-01), Ledger et al.
patent: 5567255 (1996-10-01), Steinberg

Affiliated with

Also associated with

Rating

Gas discharge apparatus for wafer etching systems does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Gas discharge apparatus for wafer etching systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gas discharge apparatus for wafer etching systems will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-255578