Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Reexamination Certificate
2009-06-08
2011-11-29
Sample, David (Department: 1783)
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
C228S110100, C228S180500, C228S001100
Reexamination Certificate
active
08066170
ABSTRACT:
A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
REFERENCES:
patent: 4572772 (1986-02-01), Peterson
patent: 5265788 (1993-11-01), Ozawa et al.
patent: 5395037 (1995-03-01), Takahashi et al.
patent: 6234376 (2001-05-01), Wicen
patent: 6267290 (2001-07-01), Murdeshwar
patent: 6866182 (2005-03-01), Wong et al.
patent: 7103959 (2006-09-01), Yeap et al.
patent: 7182793 (2007-02-01), Duan et al.
patent: 7578423 (2009-08-01), Duan et al.
patent: 7658313 (2010-02-01), Nishiura et al.
patent: 2002/0007190 (2002-01-01), Wulfman et al.
patent: 2003/0173659 (2003-09-01), Lee et al.
patent: 2007/0251980 (2007-11-01), Gillotti et al.
patent: 2007/0284421 (2007-12-01), Gillotti et al.
patent: 2008/0099531 (2008-05-01), Wong et al.
patent: 07-183323 (1995-07-01), None
patent: 07-273138 (1995-10-01), None
patent: 2008-130825 (2006-05-01), None
International Search Report Dated Jan. 14, 2010, International Application No. PCT/US2009/046535.
Gillotti Gary S.
Szczesniak Stanley
Van Emmerik Peter J.
Kulicke and Soffa Industries Inc.
Mehta Megha
Sample David
Spletzer, Sr. Christopher M.
LandOfFree
Gas delivery system for reducing oxidation in wire bonding... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Gas delivery system for reducing oxidation in wire bonding..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gas delivery system for reducing oxidation in wire bonding... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4306445