Gas-cooled clamp for RTP

Coating apparatus – Gas or vapor deposition – With treating means

Reexamination Certificate

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Details

C118S728000, C118S725000, C156S345510, C156S345520, C156S345530, C361S234000, C279S128000, C204S192100, C204S298010

Reexamination Certificate

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07033443

ABSTRACT:
The present invention is directed to a semiconductor thermal processing apparatus and a method for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a gas-cooled clamp and associated method is disclosed which provides cooling of a substrate by thermal conduction generally in the free molecular regime. The gas-cooled clamp comprises a clamping plate having a plurality of protrusions that define gaps therebetween, wherein a distance or depth of the gaps are associated with a mean free path of the cooling gas therein. The gas-cooled clamp further comprises a pressure control system operable to control a backside pressure of the cooling gas within the plurality of gaps to thus control a heat transfer coefficient of the cooling gas, wherein the heat transfer coefficient of the cooling gas is primarily a function of the pressure and substantially independent of the gap distance.

REFERENCES:
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patent: 5805408 (1998-09-01), Maraschin et al.
patent: 5810933 (1998-09-01), Mountsier et al.
patent: 5838529 (1998-11-01), Shufflebotham et al.
patent: 6073576 (2000-06-01), Moslehi et al.
patent: 6378600 (2002-04-01), Moslehi
patent: 2001/0011425 (2001-08-01), Granneman et al.
patent: 2002/0139307 (2002-10-01), Ryding et al.
patent: 2003/0030960 (2003-02-01), Kanno et al.

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