Gap distance control electroplating

Details Gap distance control electroplating Gap distance control electroplating

1980-05-30

1981-05-26

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 25, C25D 504, C25D 704

Patent

active

042696720

ABSTRACT:
An improved method of electroplating a metal upon a substrate wherein a rod electrode is axially juxtaposed with the substrate across an electrolyte-flooded plating gap and electrodeposition occurs preferentially in the region of the substrate proximal to an end portion of the rod electrode. The rod electrode is displaced relative to the substrate while its axis is kept oriented substantially perpendicular to a fixed plane to allow the metal to be successively and continuously electrodeposited over the entire area of the substrate to be electroplated. The improved method comprises controlling the position of the rod electrode relative to the surface contour of the substrate while maintaining the relationship G=Gs/sin.alpha. substantially over the area where Gs is a distance defined between the electrode end and the point of intersection of the extension of the electrode axis and the surface contour, .alpha. is an angle defined by said extension with a tangent of the surface contour at said point of intersection and G is a constant representing a reference gap spacing.

REFERENCES:
patent: 1733404 (1929-10-01), Fahrenwald
patent: 1772074 (1930-08-01), Engelhardt
patent: 2206908 (1940-07-01), Lunt

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