Galvanizing solution for the galvanic deposition of copper

Details Galvanizing solution for the galvanic deposition of copper Galvanizing solution for the galvanic deposition of copper

2005-02-22

2005-02-22

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C106S001260

Reexamination Certificate

active

06858123

ABSTRACT:
The invention relates to a novel galvanizing solution for the galvanic deposition of copper. Hydroxylamine sulfate or hydroxylamine hydrochloride are utilized as addition reagents and added to the galvanizing solution during the galvanic deposition of copper which is used in the manufacture of semiconductors.

REFERENCES:
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Mizumoto et al., “Determination of Formaldehyde on Electroless Copper Plating Solution by Potentiometric Titration”, Hyomen Gijutsu (1990), vol. 41, No. 4, pp. 412-416. Abstract only.*
James J. Kelly, “Copper Deposition in the Presence of Polyethylene Glycol,”Journal of the Electrochemical Society, Electrochemical Society, Manchester, New Hampshire, US, vol. 145, No. 10, Oct. 30, 1998, pp. 3472-3476, XP002148319.

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