Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Particulate matter
Patent
1992-12-08
1995-03-21
Nakarani, D. S.
Stock material or miscellaneous articles
Coated or structually defined flake, particle, cell, strand,...
Particulate matter
252512, 252513, 252516, 252520, 428494, 428469, 428472, 428699, 428702, B32B 516
Patent
active
053994329
ABSTRACT:
Composite particles suitable as conductive filler for electrically conductive compositions which can be used as gaskets, caulking and plastics, for example. The compositions are useful as EMI shielding and electrostatic charge dissipation materials. Methods of making and using the foregoing are also covered.
REFERENCES:
patent: 2299813 (1942-10-01), Franks
patent: 2477267 (1949-07-01), Robinson
patent: 2771380 (1956-11-01), Coleman et al.
patent: 3140342 (1964-07-01), Ehrreich et al.
patent: 3202488 (1965-08-01), Ehrreich et al.
patent: 3562124 (1971-02-01), Leon et al.
patent: 3583930 (1971-06-01), Ehrreich et al.
patent: 3609104 (1971-09-01), Ehrreich et al.
patent: 3687724 (1972-08-01), Keith et al.
patent: 3837894 (1974-09-01), Tucker, Jr.
patent: 3882507 (1975-05-01), Trimble et al.
patent: 3892600 (1975-07-01), Smeggil et al.
patent: 4092459 (1978-05-01), Deffeyes et al.
patent: 4119763 (1978-10-01), Blair
patent: 4137361 (1979-01-01), Deffeyes et al.
patent: 4218507 (1980-08-01), Deffeyes et al.
patent: 4400432 (1983-08-01), Buxbaum et al.
patent: 4434541 (1984-03-01), Powers, Jr.
patent: 4507359 (1985-03-01), Powers, Jr.
patent: 4678716 (1987-07-01), Tzeng
patent: 4711814 (1987-12-01), Teichmann
patent: 4725508 (1988-02-01), Rangaswamy et al.
patent: 4769280 (1988-09-01), Powers et al.
patent: 4882224 (1989-11-01), Moro et al.
patent: 5021368 (1991-06-01), Hoffman et al.
patent: 5026605 (1991-06-01), Kitamura et al.
patent: 5034157 (1991-07-01), Merrell et al.
Conductive Elastomer Gasket Design, EMI Shielding Engineering Handbook, Chomerics, Inc., Woburn, Mass., 25:25-26 (1985).
CRC Handbook of Chemistry and Physics, 56th Edition (Weast, Ed.), D51-D58 (1975-1976).
T. Yokoyama, Mechanofusion Treatment With Angmill And Its Potential In Industrial Application, Product Literature from the Micromeritics Laboratory of Hosokowa Micron International, Inc., Summit, N.J..
M. Alonso, Mechanism Of The Combined Coating-Mechanofusion Processing Of Powders, Powder Technology, 59:45-52 (1989).
T. Yokoyama et al., The Angmill Mechanofusion System And Its Application, KONA, No. 5, 59-68 (1987).
A New Method Of Agglomerating Heterogenous Powders, Particle Fabrication, Product Literature of Bepex Corporation, Minneapolis, Minn.
An Introduction To Powder Modification Technology, Powder and Bulk Engineering, 50-54 (Feb., 1990).
J. S. Benjamin, Mechanical Alloying, Scientific American, 234:40-48 (1976).
B. Fultz et al., Mechanical Alloying Of Fe And V Powders: Intermixing And Amorphous Phase Formation, J. Mater, Res. 4(6):1450 (1989).
Military Specification-Shielding Gasket, Electronic, Elastomer, EMI/RFI, General Specification MIL-G-83528 (Apr. 1, 1988).
Standard Method of Salt Spray (Fog) Testing, ASTM Designation:B117-85.
Product Bulletin for Information Circular No. 194 entitled Mechano Fusion, MikroPul, Hosakawa Micron International Inc., Summit, N.J..
Product Circular entitled Mechano Fusion System, MikroPul, Hosakawa Micron International Inc., Summit, New Jersey.
MIKROPUL "Mechano Fusion System".
Bulletin P.1, Process Equipment for Powder Surface Modification, Bepex Corp., Rolling Meadows, Ill.
E. J. Carlson, Less Corrosive EMI Shielding Materials for Arrow Space Applications, ITEM, 20-34 (1990).
D. M. Bigg et al., Molded Composites as EMI Shields, Industrial Research/Development, 103-105 (Jul. 1979).
H. L. El-Amin, EMI Shielding-Part II Conductive Additives, Plastics Technology, 67-72 (Aug., 1981).
Schleifstein Robert A.
Wasowicz Andrew M.
Le H. Thi
Nakarani D. S.
Potters Industries Inc.
LandOfFree
Galvanically compatible conductive filler and methods of making does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Galvanically compatible conductive filler and methods of making , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Galvanically compatible conductive filler and methods of making will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1147963