Galvanic acid copper bath and method

Details Galvanic acid copper bath and method Galvanic acid copper bath and method

1978-10-02

1980-01-01

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 338

Patent

active

041815823

ABSTRACT:
An improved galvanic acid copper bath for the deposition of shiny coatings, particularly suited for the strengthening of the conductor paths of printed circuits, which comprises the addition to standard electrolytic aqueous solutions of mineral acids and copper salts of (a) an amide of the general formula R--CO--NH.sub.2, where R is an aliphatic or aromatic hydrocarbon monomer or polymer residue, (b) an oxygen-containing high molecular weight compound and (c) an organic sulfur compound with water-solubilizing groups.

REFERENCES:
patent: 2798040 (1957-07-01), Pye et al.
patent: 2888390 (1959-05-01), Lapee
patent: 2954331 (1960-09-01), Abbott
patent: 3287236 (1966-11-01), Brugger et al.
patent: 3804729 (1974-04-01), Kardos et al.

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