Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2006-02-21
2006-02-21
Nhu, David (Department: 2818)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S105000, C438S030000
Reexamination Certificate
active
07001824
ABSTRACT:
A gallium nitride (GaN) vertical light emitting diode (LED) structure and a method of separating a substrate and a thin film thereon in the GaN vertical LED are described. The structure has a metal reflective layer for reflecting light. The method provides a laser array over the substrate. A laser light emitted by the laser array is least partially be transparent to the substrate and its energy may be absorbed by the thin film. The thin film is irradiated through the substrate. The substrate is then separated from the thin film.
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Hon Schang-Jing
Lai Mu-Jen
Nhu David
Rosenberg , Klein & Lee
Supernova Optoelectronics Corporation
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