Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Compound semiconductor
Reexamination Certificate
2005-04-19
2005-04-19
Zarabian, Amir (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Compound semiconductor
C438S604000, C438S685000
Reexamination Certificate
active
06881602
ABSTRACT:
According to a preferred embodiment of the present invention, there is provided a novel and optimal semiconductor light emitting device comprising a substrate, an n layer disposed co-extensively on the substrate, an n++layer disposed non-extensively and flush on one side of the n layer. Furthermore, a p+layer is disposed co-extensively on the n++layer of the LED according to the invention, with a p layer further disposed co-extensively on the p+layer. A p cladding layer is disposed co-extensively on the p layer. A multiple quantum well (MQW) layer is disposed co-extensively on the p cladding layer, and an n cladding layer is further disposed co-extensively on the MQW layer. A second n layer is disposed co-extensively on the n cladding layer. An n+layer is disposed co-extensively on the second n layer of the LED according to the invention. After partially etching the device, an n electrode is formed opposite n++layer non-extensively on the surface of n layer, and a second n electrode is formed non-extensively (without etching) upon the n+layer.
REFERENCES:
patent: 6524882 (2003-02-01), Takeya et al.
patent: 6555403 (2003-04-01), Domen et al.
patent: 6620238 (2003-09-01), Tsuda et al.
Chyi Jen-Inn
Lee Chia-Ming
Baker & McKenzie
Perkins Pamela E
Tekcore Co., Ltd
Zarabian Amir
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