Gallium-nitride based light emitting diode structure and...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element

Reexamination Certificate

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C438S046000

Reexamination Certificate

active

07319045

ABSTRACT:
A method for fabricating GaN-based LED is provided. The method first forms a first contact spreading metallic layer on top of the texturing surface of the p-type ohmic contact layer. The method then forms a second and a third contact spreading metallic layers on top of the first contact spreading layer. The p-type transparent metallic conductive layer composed of the three contact spreading metallic layers, after undergoing an alloying process within an oxygenic or nitrogenous environment under a high temperature, would have a superior conductivity. The p-type transparent metallic conductive layer could enhance the lateral contact uniformity between the p-type metallic electrode and the p-type ohmic contact layer, so as to avoid the localized light emission resulted from the uneven distribution of the second contact spreading metallic layer within the third contact spreading metallic layer. The GaN-based LED's working voltage and external quantum efficiency are also significantly improved.

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patent: 7053420 (2006-05-01), Tadatomo et al.
patent: 7067838 (2006-06-01), Sato et al.
patent: 7183583 (2007-02-01), Lai et al.
patent: 2002/0190263 (2002-12-01), Hata et al.
patent: 2004/0113166 (2004-06-01), Tadatomo et al.
patent: 2006/0175600 (2006-08-01), Sato et al.

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