Gallium nitride-based III-V group compound semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257S748000, C257S099000, C257SE21476, C438S653000

Reexamination Certificate

active

07859109

ABSTRACT:
The present invention relates to a gallium nitride-based compound semiconductor device and a method of manufacturing the same. According to the present invention, there is provided a gallium nitride-based III-V group compound semiconductor device comprising a gallium nitride-based semiconductor layer and an ohmic electrode layer formed on the gallium nitride-based semiconductor layer. The ohmic electrode layer comprises a contact metal layer, a reflective metal layer, and a diffusion barrier layer.

REFERENCES:
patent: 6326294 (2001-12-01), Jang et al.
patent: 2002/0014630 (2002-02-01), Okazaki et al.
patent: 2003/0001170 (2003-01-01), Shibata et al.
patent: 2003/0015721 (2003-01-01), Slater et al.
patent: 2003/0209720 (2003-11-01), Okazaki et al.
patent: 0926744 (1999-06-01), None
patent: 1168460 (2002-01-01), None
patent: 11-40846 (1999-02-01), None
patent: 2000-36619 (2000-02-01), None
patent: 2000-294837 (2000-10-01), None
patent: 0147038 (2001-06-01), None
patent: WO 02/099901 (2002-12-01), None
D. L. Hibbard, et al. “Low resistance High Reflectance Contacts to p-GaN Using Oxidized Ni/Au and Al or Ag”, Applied Physics Letters, vol. 83, No. 2, Jul. 14, 2003. pp. 311-313.
European Search Report dated Apr. 10, 2008.
English language abstract of Japanese Publication No. 11-40846.
English language abstract of Japanese Publication No. 2000-36619.
English language abstract of Japanese Publication No. 2000-294837.

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