Ga-Cu alloy for use in exchangeable electrode for an evaporation

Details Ga-Cu alloy for use in exchangeable electrode for an evaporation Ga-Cu alloy for use in exchangeable electrode for an evaporation

1979-09-04

1980-12-16

Rutledge, L. Dewayne

Specialized metallurgical processes, compositions for use therei

Processes

Free metal or alloy reductant contains magnesium

75153, C22C 3002, C22C 3004

Patent

active

042395348

ABSTRACT:
Ga-Cu alloy having the formula of Ga.sub.1-x Cu.sub.x, wherein x is a composition ratio parameter of Ga and Cu in a range of 0.0001.ltoreq..times..ltoreq.0.05. The alloy has a stable liquid phase at the normal temperature. The Ga-Cu alloy Ga.sub.1-x Cu.sub.x with a composition ratio parameter x (0.0001.ltoreq..times..ltoreq.0.03) is assembled into the exchangeable electrode of an evaporation system in such a way that the Ga-Cu alloy is filled in a clearance portion between a fixed electrode section fixed within the vacuum chamber of the evaporation system and an exchangeable electrode section on which an evaporation source is to be placed. With this construction, both of the fixed and exchangeable electrode sections are electrically connected with each other via the Ga-Cu alloy, and the exchangeable electrode section can be easily and rapidly removed from and placed onto the fixed electrode section.

REFERENCES:
patent: 3141238 (1964-07-01), Harman
Tikhomirova et al., Phys. Metals of Metallography, vol. 29 (4), (1970), 120-126.
M. Hansen, Constitution of Binary Alloys, McGraw-Hill, N. Y., 1958, pp. 582-584.
L. Holland, "Vacuum Deposition of Thin Films", 1960, pp. 7-15.
K. L. Chopra, McGraw-Hill, N. Y., 1969, pp. 1-69.
"Theories and Applications of Electron Microscope", Maruzen Co., ed., The Soc. of Electron Microscope, Japan, 1964.
G. Thomas, Transmission Electron Microscopy of Metals, John Wiley, N. Y., 1962, pp. 1 and 101-103.

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