Fusing fluid for solder-plated circuit boards

Details Fusing fluid for solder-plated circuit boards Fusing fluid for solder-plated circuit boards

1980-12-18

1982-09-21

Albrecht, Dennis L.

Compositions

Heat-exchange, low-freezing or pour point, or high boiling...

Organic components

75257, 252 77, 252 781, 427444, C09K 500, H05K 334

Patent

active

043506020

ABSTRACT:
An improved fusing fluid or protectively coating solder-plated printed circuit conductors while they are heated to fuse the solder. Certain prior fusing fluids tend to pull away from portions of the molten solder surface, leaving them unprotected from oxidation. The improved fluid contains a small percentage of phenothiazine or a homologue, which promote complete wetting of the solder surface without causing the foaming and cleaning difficulties associated with surfactants.

REFERENCES:
patent: 3779927 (1973-12-01), Howell et al.

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