Fusible-link semiconductor memory

Details Fusible-link semiconductor memory Fusible-link semiconductor memory

1978-04-27

1980-07-01

Tupman, W. C.

Metal working

Method of mechanical manufacture

Assembling or joining

29580, 29591, B01J 1700

Patent

active

042098947

ABSTRACT:
A programmable read only memory array of the fusible link type employs a small part of a deposited metal film as a fuse. The film is covered by a protective glaze which seals the surface of the semiconductor chip to avoid deterioration of the transistors or other components. In order to minimize heat loss to the semiconductor substrate when programming, and to provide a cavity beneath the protective glaze, the metal film is raised above the surface at the position of the fusible link. This is accomplished by a segment of photoresist applied prior to metal deposition, then removed with photoresist stripper after the metal is patterned.

REFERENCES:
patent: 3539705 (1970-11-01), Nathanson
patent: 4032949 (1977-06-01), Bierig

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