Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate
2008-07-22
2008-07-22
McClendon, Sanza L (Department: 1796)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
C523S161000, C524S495000, C524S496000, C524S403000, C524S423000, C524S548000, C524S400000, C524S414000
Reexamination Certificate
active
07402616
ABSTRACT:
A fusible conductive ink for use in manufacturing microfluidic analytical systems includes micronised powder containing platinum and carbon, poly(bisphenol A-co-epichlorohydrin)-glycidyl end capped polymer, and a solvent. In addition, the ratio of micronised powder to poly(bisphenol A-co-epichlorohydrin)-glycidyl end capped polymer is in the range of 3:1 to 1:3. The fusible conductive inks can be employed in the manufacturing of microfluidic systems to form electrodes, electrically conductive traces and/or electrically conductive contact pads.
REFERENCES:
patent: 5047283 (1991-09-01), Leatherman et al.
patent: 5707502 (1998-01-01), McCaffrey et al.
patent: 5857983 (1999-01-01), Douglas et al.
patent: 5888390 (1999-03-01), Craig
patent: 5906723 (1999-05-01), Mathies et al.
patent: 6110576 (2000-08-01), Decker et al.
patent: 6176962 (2001-01-01), Soane et al.
patent: 6284113 (2001-09-01), Bjornson et al.
patent: 6322736 (2001-11-01), Bao et al.
patent: 6444461 (2002-09-01), Knapp et al.
patent: 6503359 (2003-01-01), Virtanen
patent: 6593398 (2003-07-01), Breton et al.
patent: 6599408 (2003-07-01), Chan et al.
patent: 6627058 (2003-09-01), Chan
patent: 6990849 (2006-01-01), Bohm et al.
patent: 7204940 (2007-04-01), McDonald et al.
patent: 2002/0076597 (2002-06-01), Chang et al.
patent: 2002/0079219 (2002-06-01), Zhao
patent: 2002/0185183 (2002-12-01), O'Connor et al.
patent: 2002/0189946 (2002-12-01), Walnright et al.
patent: 2003/0010228 (2003-01-01), Lofink
patent: 2003/0029724 (2003-02-01), Derand et al.
patent: 2003/0136509 (2003-07-01), Virtanen
patent: 2003/0203504 (2003-10-01), Hefti
patent: 2003/0230488 (2003-12-01), Lawrence et al.
patent: 2004/0249253 (2004-12-01), Racchini et al.
patent: 0352925 (1994-12-01), None
patent: 1367101 (2003-12-01), None
patent: 1391242 (2004-02-01), None
patent: WO 97/30344 (1997-08-01), None
patent: WO 99/19717 (1999-04-01), None
patent: WO 00/62931 (2000-10-01), None
patent: WO 01/35088 (2001-05-01), None
patent: WO 01/41931 (2001-06-01), None
patent: WO 01/54810 (2001-08-01), None
patent: WO 02/024322 (2002-03-01), None
patent: WO 02/49507 (2002-06-01), None
patent: WO 03/045557 (2003-06-01), None
European Search Report, Munich, Germany, Nov. 28, 2005, re European Application 05256108.1.
Egloff, E. Ralph, “A Flexible Solution to Solderless Surface Mount”,Adhesives Age, pp. 16-20 (Dec. 1995).
Maclennan Margaret
McNeilage Alan
Moffat James
Rodgers James Iain
Lifescan Inc.
McClendon Sanza L
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