Fuse trimming in plastic package devices

Details Fuse trimming in plastic package devices Fuse trimming in plastic package devices

1993-11-08

1995-01-24

Yoo, Do Hyun

Static information storage and retrieval

Read only systems

Fusible

36518907, 365196, 365201, 3652257, G11C 1716

Patent

active

053847270

ABSTRACT:
A method and apparatus provide fuse trimming of analog integrated circuit parameters in plastic packages. The apparatus includes an electrically interruptible circuit element, such as a fuse; a level reading unit which reads the state of the electrically interruptible circuit element and generates a code in response to the state; a state altering unit, such as a current source for providing a blow current; and a control circuit. A test level reading device allows screening for marginally-blown fuses. A switchable element removes applied voltage from fuses when the fuse is not being blown or read to prevent fuse regrowth.

REFERENCES:
patent: 5083293 (1992-01-01), Gilberg et al.
patent: 5260907 (1993-11-01), Kim
patent: 5325323 (1994-06-01), Nizaka
"A Low-Power 12-b Analog-to-Digital Converter with On-Chip Precision Trimming", de Wit, et al., IEEE Journal of Solid-State Circuits, vol. 28, No. 4, Apr. 93, pp. 455-461.

Affiliated with

Also associated with

Rating

Fuse trimming in plastic package devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fuse trimming in plastic package devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fuse trimming in plastic package devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1472378