Fuse structures and integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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Details

C257S209000, C257S499000, C257SE23149

Reexamination Certificate

active

07732892

ABSTRACT:
Fuse structures and integrated circuit devices are disclosed. An exemplary embodiment of a fuse structure comprises a first and second metal pads formed at different positions in a first dielectric layer and a conductive line formed in a second dielectric layer underlying the first dielectric layer, electrically connecting the first and second pad. The conductive line is formed with at least one first portion at an end thereof and a second portion connected with the first portion, wherein the width of the first portion is greater than the width of the second portion.

REFERENCES:
patent: 6667537 (2003-12-01), Koike et al.
patent: 6693481 (2004-02-01), Zheng
patent: 7009222 (2006-03-01), Yang et al.
patent: 2002/0005563 (2002-01-01), Shu
patent: 2003/0160298 (2003-08-01), Nakamura
patent: 2005/0285224 (2005-12-01), Tsutsui
patent: 2006/0289898 (2006-12-01), Kono et al.
patent: 2007/0052063 (2007-03-01), Ueda
patent: 2007/0145515 (2007-06-01), Chen et al.
patent: 1430273 (2003-07-01), None
patent: 1581479 (2005-02-01), None
patent: 1716591 (2006-01-01), None

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