Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2006-11-03
2010-06-08
Nguyen, Cuong Q (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S209000, C257S499000, C257SE23149
Reexamination Certificate
active
07732892
ABSTRACT:
Fuse structures and integrated circuit devices are disclosed. An exemplary embodiment of a fuse structure comprises a first and second metal pads formed at different positions in a first dielectric layer and a conductive line formed in a second dielectric layer underlying the first dielectric layer, electrically connecting the first and second pad. The conductive line is formed with at least one first portion at an end thereof and a second portion connected with the first portion, wherein the width of the first portion is greater than the width of the second portion.
REFERENCES:
patent: 6667537 (2003-12-01), Koike et al.
patent: 6693481 (2004-02-01), Zheng
patent: 7009222 (2006-03-01), Yang et al.
patent: 2002/0005563 (2002-01-01), Shu
patent: 2003/0160298 (2003-08-01), Nakamura
patent: 2005/0285224 (2005-12-01), Tsutsui
patent: 2006/0289898 (2006-12-01), Kono et al.
patent: 2007/0052063 (2007-03-01), Ueda
patent: 2007/0145515 (2007-06-01), Chen et al.
patent: 1430273 (2003-07-01), None
patent: 1581479 (2005-02-01), None
patent: 1716591 (2006-01-01), None
Jeng Shin-Puu
Wu Anbiarshy
Birch & Stewart Kolasch & Birch, LLP
Nguyen Cuong Q
Taiwan Semiconductor Manufacturing Co. Ltd.
Tran Trang Q
LandOfFree
Fuse structures and integrated circuit devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fuse structures and integrated circuit devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fuse structures and integrated circuit devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4249514