Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2007-02-13
2007-02-13
Lee, Eugene (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257SE23149, C438S601000
Reexamination Certificate
active
10850201
ABSTRACT:
A fuse structure for a semiconductor device is provided. The fuse structure includes a fuse layer between the upper and lower insulating layers. The fuse layer is connected to the other metal layers through the via plugs. The fuse layer includes at least two separate blocks and at least a connecting block. For the current flowing through the separated blocks in a zig-zag path, of the fuse structure provides at least a fusing point or more than one fusing points. In this way, the negative impact of the single failed fuse can be reduced, thus increasing the reliability of the fuse structure. Also the damage to the devices adjacent to the fuse due to the heat generated by the current can be prevented because when the heat generated during the fuse blowing process will be conducted to the adjacent blocks to facilitate heat dissipation.
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Cheng Chun-Wen
Hsueh Vincent
Lee Richard
Liang Chia-Wen
J.C. Patents
Kraig William F.
Lee Eugene
United Microelectronics Corp.
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