Fuse structure connecting first level and second level interconn

Details Fuse structure connecting first level and second level interconn Fuse structure connecting first level and second level interconn

1998-09-21

1999-12-28

Sparks, Donald

Electricity: electrothermally or thermally actuated switches

Electrothermally actuated switches

Fusible element actuated

337296, 337290, 337160, 337405, 257529, 257530, H01H 85046, H01H 8508, H01L 27115, H01L 2900, H01R 909

Patent

active

060087161

ABSTRACT:
The present invention provides a fuse structure formed in an inter-layer insulator having a first level interconnection and a second level interconnection isolated by the inter-layer insulator from the first level interconnection. The fuse structure comprises a conductive plug for providing an electrical connection between a first connecting part of the first level interconnection and a second connecting part of the second level interconnection, wherein the fuse structure further comprises at least a void which extends within the inter-layer insulator and also at least a part of the void extends adjacent to the second connecting part of the second level interconnection, so that when the second connecting part is rapidly evaporated by receiving a thermal energy, an evaporated material of the second connecting part is deposited on an inner wall of the void for causing an electrical disconnection between the first and second interconnections.

REFERENCES:
patent: 4893167 (1990-01-01), Boudou et al.
patent: 5420455 (1995-05-01), Gilmour et al.
patent: 5451811 (1995-09-01), Whitten et al.
patent: 5625219 (1997-04-01), Takagi
patent: 5861674 (1999-01-01), Ishikawa

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