Further method to pattern a substrate

Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement

Reexamination Certificate

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Details

C430S302000, C430S312000, C430S328000

Reexamination Certificate

active

07150949

ABSTRACT:
The present invention relates to methods for patterning substrates, such as reticles, masks or wafers, which reduce critical dimension variations, improving CD uniformity. In particular, it relates to tuning doses applied in passes of a multipass writing strategy to measurable characteristics of resists or radiation sensitive layers applied to the substrates. Particular writing strategies are described. Aspects of the present invention are described in the claims, specification and drawings.

REFERENCES:
patent: 5774254 (1998-06-01), Berlin
patent: 6348907 (2002-02-01), Wood
patent: 2001/0040670 (2001-11-01), Fielding

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