Furnace to solder integrated circuit chips

Details Furnace to solder integrated circuit chips Furnace to solder integrated circuit chips

1988-07-22

1990-03-20

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 45, 228179, 228191, 21912165, B23K 2600, B23K 2602

Patent

active

049094289

ABSTRACT:
A furnace for soldering integrated circuit chips on a ceramic substrate has a heating plate supporting the substrate, the plate comprising perforations at the places where the integrated circuit chips will be soldered, behind the plate, a heat radiation source and a device to direct the radiation as desired towards only one of the apertures of the plate at a time.

REFERENCES:
patent: 3387365 (1968-06-01), Stelmak
patent: 3617682 (1971-11-01), Hall
patent: 3717742 (1973-02-01), Fottler
patent: 3742181 (1973-06-01), Costello
patent: 3887997 (1975-06-01), Hartleroad et al.
patent: 4160893 (1979-07-01), Meyen et al.
patent: 4278867 (1981-07-01), Tan
patent: 4634043 (1987-01-01), Avedissian
IBM Technical Disclosure Bulletin, "Simultaneous Laser-Assisted Solder Reflow . . . ", vol. 31, No. 6, pp. 7-9, Nov. 1988.
IBM Technical Disclosure Bulletin, vol. 16, No. 4, Sep. 1973, p. 1154, New York, U.S.; DeBoskey et al., "Accurate Chip Placement On A Substrate."
Patent Abstracts of Japan, vol. 10, No. 368 (M-543) [2425], Dec. 9, 1986; & JP-A-61 162 292 (Yutaka Kaneda) 22-07-1986.

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