Furnace for processing semiconductor wafers

Details Furnace for processing semiconductor wafers Furnace for processing semiconductor wafers

1998-10-27

2000-12-05

Walberg, Teresa

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

118725, 427557, 392416, F27B 514

Patent

active

061570036

ABSTRACT:
A furnace for processing semiconductor wafers including an insulating enclosure; a first heating apparatus disposed centrally with respect to the insulating enclosure; a frame operative to support a multiplicity of semiconductor wafers in a nearly vertical orientation in at least one right polyhedronal tier about and facing the first centrally disposed heating apparatus; a double-walled quartz enclosure for enclosing the wafers which is operative to enable the wafers to be processed in a predetermined controlled environment; and a second heating apparatus disposed between the quartz enclosure and the insulating enclosure arranged, together with the first heating apparatus, for substantially uniform heating of the wafers.

REFERENCES:
patent: 2885997 (1959-05-01), Schwindt
patent: 3659552 (1972-05-01), Briody
patent: 4422407 (1983-12-01), Bessot et al.
patent: 4615294 (1986-10-01), Scapple et al.
patent: 4823736 (1989-04-01), Post et al.
patent: 5315092 (1994-05-01), Takahashi et al.
patent: 5445973 (1995-08-01), Hedstrom
patent: 5710407 (1998-01-01), Moore et al.
patent: 5855970 (1999-01-01), Inushima et al.

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