Heating – Advancing structure flexing – looping or coiling sheet – web...
Patent
1988-09-07
1991-03-05
Yuen, Henry C.
Heating
Advancing structure flexing, looping or coiling sheet, web...
432122, 432242, F27B 928
Patent
active
049973649
ABSTRACT:
A furnace assembly for automatically transporting circuit board of varying sizes through a firing chamber and for maintaining heat within the firing chamber and preventing ambient air from entering into the firing chamber by having an adjustable twin-track rail assembly for housing and positioning conveyor belts which secure the circuit boards and by having baffle gate chambers in which a series of baffle gates maintain a constant atmosphere at the open ends of the firing chamber.
REFERENCES:
patent: 15273 (1922-01-01), Fuller
patent: 890252 (1908-06-01), Thompson
patent: 1537027 (1925-05-01), Gleason et al.
patent: 2200619 (1940-05-01), Fallon
patent: 2977106 (1961-03-01), Duff
patent: 3063878 (1962-11-01), Wilson
patent: 3204753 (1965-09-01), Moseley
patent: 3467366 (1969-09-01), Westeren et al.
patent: 3606288 (1971-09-01), Bloom
patent: 3756489 (1973-09-01), Chartet
patent: 3759662 (1973-09-01), Bengel et al.
patent: 3778221 (1973-12-01), Bloom
patent: 4274529 (1981-06-01), Mori et al.
patent: 4285668 (1981-08-01), Pepe
patent: 4403953 (1983-09-01), Susuki
patent: 4411075 (1983-10-01), Blaudszun
patent: 4493159 (1985-01-01), Schutz et al.
patent: 4517448 (1985-05-01), Crain et al.
patent: 4631812 (1986-12-01), Young
patent: 4643129 (1987-02-01), Sari
patent: 4672914 (1987-06-01), Sari
Buonauro John A.
Girard Thomas J. B.
McGrath Robert E.
Romance Joseph S.
Radiant Technology Corporation
Yuen Henry C.
LandOfFree
Furnace assembly for reflowing solder on printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Furnace assembly for reflowing solder on printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Furnace assembly for reflowing solder on printed circuit boards will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-493486