Furan-containing hole transporting materials

Details Furan-containing hole transporting materials Furan-containing hole transporting materials

2006-10-31

2006-10-31

Garrett, Dawn L. (Department: 1774)

Stock material or miscellaneous articles

Composite

Of inorganic material

C428S917000, C313S504000, C313S506000, C549S472000, C549S505000, C549S507000

Reexamination Certificate

active

07128983

ABSTRACT:
A furan-containing compound of formula (I):Ar is aryl, heteroaryl, or oligoaryl; A is furyl; B is aryl or heteroaryl; R1is hydrogen, alkenyl, alkynyl, aryl, heteroaryl, cyclyl, heterocyclyl, or oligoaryl; and R2is hydrogen, alkyl, alkenyl, alkynyl, aryl, heteroaryl, cyclyl, or heterocyclyl. The compound is useful as a hole transporting material in an organic light emitting diode device.

REFERENCES:
patent: 5281489 (1994-01-01), Mori et al.
patent: 5563424 (1996-10-01), Yang et al.
patent: 2003/0091860 (2003-05-01), Oshiyama et al.
patent: 07-325329 (1995-12-01), None
Parakka et al., Synthetic Metals, 68, (1995), pp. 275-279.
Hucke et al., J. Org. Chem. (1998), 63, p. 7413-7417.
Bilik et al., Chembiochem, (2001), vol. 2, pp. 559-569.
Adachi et al., Appl. Phys. Lett., 56 (9), Feb. 26, 1990, p. 799-801.
Chemical and Pharmaceutical Bulletin, 29(3), (1981), p. 635-645.
Lee et al., “One-Pot Synthesis of Substituted Furans and Pyrroles from Propargylic Dithioacetals, New Annulation Route to Highly Photoluminescent Oligoaryls”, J. Am. Chem. Soc., 122:4992-4993, 2000.
Zhang et al., “Non-amine-based furan-containing oligoaryls as efficient hole transporting materials”, Chem. Commun., 2336-2337, 2002.

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