Functionally graded metal substrates and process for making same

Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles

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228246, 257720, 257796, 361679, 361704, 361705, 361707, 361708, 361709, 361719, 419 6, 419 7, 419 8, 419 9, 419 10, 419 27, 419 38, 419 66, 428550, 428553, 428555, 428567, 428569, 428577, 428610, 428613, 428618, 428620, 428627, 428634, 428637, 428649, 428650, 428655, 428656, 428686, B22F 700, B22F 326

Patent

active

061140481

ABSTRACT:
The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In a preferred embodiment of the invention a functional insert powder composition of loose powder metal is placed in a compact of a surrounding body powder composition and both metal compositions are sintered in a sintering furnace to form a sintered part. The sintered part is infiltrated in part or in whole with a molten metal compound to produce a functionally graded metal substrate having a density of at least 90% of theoretical. A heat-generating component such as a chip can be attached to the metal substrate for use in microelectronic packaging. When the functionally-graded metal substrate has two discrete compositions of copper/tungsten the surrounding body which has a CTE that ranges from about 5.6ppm/.degree. C. to about 7 ppm/.degree. C. constrains the expansion of the functional insert which has a thermal conductivity that ranges from about 200 W/mK to about 400 W/mK.

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