Functional fluid additives for acid copper electroplating baths

Details Functional fluid additives for acid copper electroplating baths Functional fluid additives for acid copper electroplating baths

1992-12-23

1994-07-12

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

106126, C25D 338

Patent

active

053285891

ABSTRACT:
A process and composition for high acid/low metal copper electroplating baths with improved leveling, adhesion, ductility and throwing power. The bath includes effective amounts of a functional fluid having at least one ether group derived from an alcohol epoxy or a bisphenol A and containing ethoxy and propoxy functionalities.

REFERENCES:
patent: 3267010 (1966-08-01), Creutz
patent: 3328273 (1967-06-01), Creutz
patent: 3770598 (1973-11-01), Creutz
patent: 3832291 (1974-08-01), Arcilesi
patent: 4110176 (1978-08-01), Creutz
patent: 4336114 (1982-06-01), Mayer et al.
patent: 4374709 (1983-02-01), Combs

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