Functional and stress testing of LGA devices

Details Functional and stress testing of LGA devices Functional and stress testing of LGA devices

2008-07-29

2008-07-29

Tang, Minh N (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S760020, C324S765010

Reexamination Certificate

active

11747200

ABSTRACT:
Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

REFERENCES:
patent: 5977785 (1999-11-01), Burward-Hoy
patent: 6911836 (2005-06-01), Cannon et al.
patent: 6975028 (2005-12-01), Wayburn et al.
patent: 7100389 (2006-09-01), Wayburn et al.
patent: 2006/0071678 (2006-04-01), Norris

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