Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...
Reexamination Certificate
2005-04-05
2005-04-05
King, Roy (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal or alloy coating on...
C205S104000, C205S123000, C205S241000, C205S252000, C228S208000, C228S254000
Reexamination Certificate
active
06875332
ABSTRACT:
The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has been put to a practical use in such a way that the function of existing alloy plating of this type has been significantly improved to eliminate toxic plating from various kinds of electronic components for use in electronic devices so that it is useful in protecting the environment.
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patent: 5643432 (1997-07-01), Qiu
patent: 5674374 (1997-10-01), Sakurai et al.
patent: 5759379 (1998-06-01), Cavallotti et al.
patent: 5948235 (1999-09-01), Arai
patent: 6203684 (2001-03-01), Taylor et al.
patent: 6478944 (2002-11-01), Ishiyama
patent: 0474499 (1992-03-01), None
patent: 63187654 (1988-08-01), None
patent: 63-49382 (1988-10-01), None
patent: 2543619 (1996-07-01), None
An English Language abstract of JP 63-187654, no date.
An English Language abstract of JP 63-49382, no date.
IEEE Standard Dictionary of Electrical and Electronics Terms, ANSI/IEEE std 100-1988, Fourth Edition, pp. 1013 and 906, no date.
King Roy
Leader William T.
Nishihara Rikoh Corporation
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