Metal fusion bonding – Process – Critical work component – temperature – or pressure
Patent
1977-01-10
1978-03-07
Steiner, Arthur J.
Metal fusion bonding
Process
Critical work component, temperature, or pressure
75175A, C22C 1300
Patent
active
RE0295639
ABSTRACT:
[A solder alloy for use in automated soldering of workpieces by application thereto of liquid solder from a molten reservoir. The alloy consists essentially of from about 50 to 57.5% by weight tin, from about 1.5 to 4% by weight antimony, with the balance being substantially lead. The alloy is preferably further characterized in displaying a solidus-to-liquidus temperature range no greater than that of a 60/40 weight ratio tin/lead solder.]
An improved process for machine soldering a workpiece by application thereto of a liquid solder from a molten reservoir is disclosed. The improvement resides in the use of solder alloys having a composition of approximately 55% tin, 2.77% antimony, the remainder being substantially lead or approximately 52% tin, 3% antimony, the remainder being substantially lead.
REFERENCES:
patent: 1087561 (1914-02-01), Tebbetts
patent: 1568224 (1926-01-01), Karafiat
patent: 1669580 (1928-05-01), Speichert
patent: 3607252 (1971-09-01), North
H. H. Manko, Solders and Soldering, McGraw-Hill Book Co., N.Y., 1964, pp. 64 & 91-93.
C. L. Barber, Solder . . . Its Fundamentals and Usage, Kester Solder Co., Second Ed. (1961), pp. 9-11.
W. R. Lewis, Notes on Soldering, Tin Research Institute, 4th Ed. (1961), pp. 21 & 22.
J. McKeown, The Properties of Soft Solders and Soldered Joints, British Non-Ferrous Metals Research Ass'n. (1948), pp. 28, 29, 34, 36, 39 & 40.
C. J. Thwaites, "The Attainment of Reliability in Modern Soldering Techniques for Electronic Assemblies," Internat. Metallurgical Rev., vol. 17 (1972) pp. 149, 152-154 & 173.
C. J. Thwaites, Assuring Reliability In Soldered Joints . . . of Printed Circuit Assemblies, Tin Research Institute, (1967) p. 10.
T. E. Davis, The Use of Tin and Tin Alloys in the Electronics Industry, paper presented at the Am. Electroplater's Soc. Third Plating in the Elect. Ind. Symp., Palo Alto, CA. (2-3-71).
M. L. Ackroyd et al., "Effect of Certain Impurity Elements . . . of 60% Tin-40% Lead Solders," Metals Technology, Feb. 1975, pp. 73, 75, 76, 81 & 82.
Alpha Metals, Inc.
Steiner Arthur J.
LandOfFree
Functional alloy for use in automated soldering processes does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Functional alloy for use in automated soldering processes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Functional alloy for use in automated soldering processes will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2014008