Functional alloy for use in automated soldering processes

Details Functional alloy for use in automated soldering processes Functional alloy for use in automated soldering processes

1975-02-25

1976-03-23

Rutledge, L. Dewayne

Metal fusion bonding

Process

Critical work component, temperature, or pressure

75175A, C22C 1300

Patent

active

039455564

ABSTRACT:
A solder alloy for use in automated soldering of workpieces by application thereto of liquid solder from a molten reservoir. The alloy consists essentially of from about 50 to 57.5% by weight tin, from about 1.5 to 4% by weight antimony, with the balance being substantially lead. The alloy is preferably further characterized in displaying a solidus-to-liquidus temperature range no greater than that of a 60/40 weight ratio tin/lead solder.

REFERENCES:
patent: 1087561 (1914-02-01), Tebbetts
patent: 1568224 (1926-01-01), Karafiat
patent: 1669580 (1928-05-01), Speichert
patent: 3607252 (1971-09-01), North

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