Function module with built-in heat dissipation device

Details Function module with built-in heat dissipation device Function module with built-in heat dissipation device

2006-10-31

2006-10-31

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S121000, C361S697000, C361S715000

Reexamination Certificate

active

07130191

ABSTRACT:
A function module with built-in heat dissipation device. The function module includes a first circuit board, a second circuit board, a first height-compensation heat spreader, a second height-compensation heat spreader, and a heat dissipation fin. The first circuit board has a first surface, a first and second device. The second circuit board has a second surface facing the first surface, a third device, and a fourth device. The first height-compensation heat spreader has a first face, contacting the first and second devices simultaneously, and a third face, opposite to the first face. The second height-compensation heat spreader has a second face, contacting the third and fourth devices simultaneously, and a fourth face, opposite to the second face. The heat dissipation fin is disposed between the first circuit board and the second circuit board.

REFERENCES:
patent: 4884168 (1989-11-01), August et al.
patent: 5768104 (1998-06-01), Salmonson et al.
patent: 6154367 (2000-11-01), Pavlovic
patent: 6219236 (2001-04-01), Hirano et al.
patent: 6466441 (2002-10-01), Suzuki

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