Full-wafer or large area imprinting with multiple separated...

Details Full-wafer or large area imprinting with multiple separated... Full-wafer or large area imprinting with multiple separated...

2011-04-19

2011-04-19

Del Sole, Joseph S (Department: 1743)

Plastic and nonmetallic article shaping or treating: processes

Direct application of fluid pressure differential to...

Labeling or embossing indicia

C264S297600, C264S319000

Reexamination Certificate

active

07927541

ABSTRACT:
A layer on a substrate is formed using an imprint lithography system. The layer is formed by providing a plurality of flowable regions on the substrate, spreading material in the flowable regions, and contacting the regions with a plurality of imprint lithography molds that are disposed on a template.

REFERENCES:
patent: 5669303 (1997-09-01), Maracas et al.
patent: 5804017 (1998-09-01), Hector
patent: 6305925 (2001-10-01), Cassani

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