Metal working – Method of mechanical manufacture – Electrical device making
Patent
1987-02-02
1988-08-30
Kucia, R. R.
Metal working
Method of mechanical manufacture
Electrical device making
29593, 29840, 361398, 437205, H05K 334
Patent
active
047666706
ABSTRACT:
An electronic packaging structure, and a method of making this structure, are disclosed. The electronic packaging structure comprises a full panel, circuitized flexible film semiconductor chip carrier mounted on a circuitized substrate such as a printed circuit board. A plurality of semiconductor chips are mounted on the carrier in a selected pattern, and the carrier, with the chips, is mounted on a matching pattern of bonding sites on the circuitized substrate. Preferably, the circuitized flexible film semiconductor chip carrier is manufactured on a support structure used to facilitate handling of the circuitized flexible film and to facilitate heat transfer from the semiconductor chips mounted on a carrier to a heat sink which is part of the circuitized substrate. Also, the semiconductor chip mounted on the flexible film chip carrier may be tested, and burned in, while on the support structure before the chip carrier, with the chips, is mounted on the circuitized substrate.
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Gazdik Charles E.
McBride Donald G.
Seraphim Donald P.
Toole Patrick A.
Adour David L.
International Business Machines - Corporation
Kucia R. R.
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