Frostless interface supercooled VLSI system

Details Frostless interface supercooled VLSI system Frostless interface supercooled VLSI system

1987-05-07

1989-01-24

James, Andrew J.

357 81, H01L 2344, H01L 23/46, H01L 2336

Patent

active

048004227

ABSTRACT:
A double walled vessel having a styrofoam filling between the double walls internally supports a semiconductor circuit to which is attached at least one flat ribbon cable. The semiconductor circuit is immersed in liquid nitrogen with at least one flat ribbon cable extending to the top lip of the vessel. Carbon conductors are connected to each conductor of the flat ribbon cable and extend to the outer wall of the vessel. Another flat ribbon cable is connected to the carbon conductors and to an electrical connector. A double walled top having a styrofoam filling is secured to the vessel such that the carbon conductors are sealed between the styrofoam filling of the top and the double walled vessel thereby preventing the formation of frost on the flat ribbon cable and connector that is external to the sealed vessel. Various tubings are inserted through the double walled vessel to permit the insertion of liquid nitrogen and the drawing off of gaseous nitrogen.

REFERENCES:
patent: 3328642 (1967-06-01), Haumesser et al.
patent: 3475660 (1969-10-01), Coblenz
patent: 3780356 (1973-12-01), Laing
patent: 4279127 (1981-07-01), Longsworth
patent: 4395728 (1983-07-01), Li
IBM Journal of Research and Development, vol. 24, No. 2, Mar. 1980 (New York), A. V. Brown: "An Overview of Josephson Packaging".
Proceedings of the 8th International Cryogenic Engineering Conference, 3-6 Jun. 1980 (Genova), vol. ICEC-8, R. W. Guernsey, Jr.: "Cryogenics for Superconducting Computers".

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