Frontal illumination system for semiconductive wafers

Photocopying – Projection printing and copying cameras – Identifying – composing – or selecting

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355 1, 355 45, G03B 2752, G03B 2770

Patent

active

044227558

ABSTRACT:
A projection lens is disposed directly above a vacuum chuck for projecting an image of an illuminated portion of a semiconductive wafer held thereby to an image plane where that image may be viewed through a pair of objective lenses of a compound microscope. Microcircuitry contained on a reticle held by a holder positioned above the projection lens is photometrically printed onto the semiconductive wafer by passing exposure light through the reticle and the projection lens to the semiconductive wafer. At least one fiber optic source of illuminating light and one or more optical lenses are employed for projecting an image of the fiber optic light source through the objective lens to an entrance pupil of the projection lens without passing through the reticle to provide uniform illumination of the semiconductive wafer and facilitate direct wafer alignment prior to photometrically printing on the semiconductive wafer.

REFERENCES:
patent: 3610750 (1971-10-01), Lewis et al.
patent: 3963353 (1976-06-01), Hemstreet
patent: 3984186 (1976-10-01), Momose et al.
patent: 4068947 (1978-01-01), Buckley et al.

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