Front surface metallization and encapsulation of solar cells

Details Front surface metallization and encapsulation of solar cells Front surface metallization and encapsulation of solar cells

1982-08-30

1984-05-22

Kimlin, Edward C.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With means applying wave energy or electrical energy...

65 36, 29572, 136251, 136256, 136259, B32B 1902, C03B 2320, C03B 3308, H01C 708

Patent

active

044500335

ABSTRACT:
Method and apparatus for the front surface metallization and encapsulation of solar cells of the type comprising p and n semiconductor strata separated by a barrier junction, and front and rear conducting strata constituting electrical contacts, wherein the front conducting stratum is a novel metallic grid permitting transmission of solar radiation to the semiconductor strata. This metallic grid is in the form of a mesh of wires of sufficiently high tensile strength to be self-supporting while being drawn from spools or the like into contact with one or more components of the solar cell before completion of the cell's fabrication.
The method is characterized in that the metallic grid, in the form of the mesh of wires, is encapsulated between a transparent cover plate and the exposed front surface of the semiconductor strata, the mesh forming an electrical contact with the front surface of the semiconductor strata simultaneously that the plate is electrostatically bonded thereto.
The apparatus is preferably automated and conveyorized.

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