Front side hot-swap chassis management module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S752000, C361S790000, C361S701000

Reexamination Certificate

active

10748385

ABSTRACT:
A modular platform is provided. The modular platform includes a chassis having a front side and a back side, and configured to receive modular platform boards, a plenum associated with the chassis and at least one chassis management module removably disposed in the at least one plenum in a substantially parallel relationship with a flow of a cooling medium passing through the plenum.

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patent: 6222729 (2001-04-01), Yoshikawa
patent: 6278608 (2001-08-01), Ater et al.
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patent: 2002/0149911 (2002-10-01), Bishop et al.
patent: 2003/0235042 (2003-12-01), Harris et al.
patent: 2005/0071689 (2005-03-01), Coward et al.
Advanced TCA™, PICMG® 3.0 Revision 1.0, Advanced TCA™ Base Specification, Dec. 30, 2002, pp. i-414.
Release Notes, PICMG ECN 3.0-1.0-001, Feb. 17, 2004, pp. 1-4, with AdvancedTCA®, PICMG Specification, Engineering Change Notice 3.0-1.0-001, Jan. 14, 2004, Affected Specification: PICMG 3.0 R1.0, pp. i-D-12.

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