Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Patent
1997-08-29
1999-09-28
Kincaid, Kristine
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
439609, 439108, H05K 900
Patent
active
059592443
ABSTRACT:
An EMI gasket formed from a conductive sheet having a hole therein. A first set of conductive fingers is disposed along the periphery of the hole protruding away from the conductive sheet on the front side. A second set of conductive fingers is disposed along the periphery of the hole protruding away from the conductive sheet on the back side. The first conductive fingers are alternately interleaved with the second conductive fingers. Each of the first conductive fingers includes a first and a second portion defined by a bend. The first portion is disposed in the plane of the sheet. The second portion is disposed in a plane orthogonal to the plane of the sheet. The first conductive fingers operate to engage a conductive portion of a panel. The second conductive fingers operate to engage a conductive portion of a component. The conductive sheet and the first and second sets of conductive fingers are made of spring steel. A third set of conductive fingers similar to the first fingers may be included, disposed on the outer periphery of the conductive sheet. In an electronic component assembly having EMI reduction properties, the EMI gasket is interposed between the component and the conductive exterior panel. An intermediate panel may be interposed between the gasket and the exterior panel. Holes in the intermediate panel allow the first conductive fingers to engage the exterior panel.
REFERENCES:
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patent: 4688868 (1987-08-01), Noyes
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patent: 5250751 (1993-10-01), Yamaguchi
patent: 5251109 (1993-10-01), Baitz
patent: 5317105 (1994-05-01), Weber
patent: 5679923 (1997-10-01), Le
Hart Kevin M.
Hewlett--Packard Company
Kincaid Kristine
Ngo Hung V
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