Frequency division multiple access communications within a...

Details Frequency division multiple access communications within a... Frequency division multiple access communications within a...

2011-03-01

2011-03-01

Nguyen, Tuan H (Department: 2618)

Telecommunications

Transmitter and receiver at separate stations

Distortion, noise, or other interference prevention,...

C455S090100, C455S090300

Reexamination Certificate

active

07899399

ABSTRACT:
A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers.

REFERENCES:
patent: 6942157 (2005-09-01), Nozawa et al.
patent: 7257093 (2007-08-01), Witzke et al.
patent: 7650126 (2010-01-01), Birru et al.
patent: 2006/0172716 (2006-08-01), Yoshii et al.
patent: 2008/0305823 (2008-12-01), Matsumoto et al.

Affiliated with

Also associated with

Rating

Frequency division multiple access communications within a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Frequency division multiple access communications within a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Frequency division multiple access communications within a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2711269