Free-radically radiation-curable, solvent-free and printable...

Details Free-radically radiation-curable, solvent-free and printable... Free-radically radiation-curable, solvent-free and printable...

2007-09-11

2007-09-11

McClendon, Sanza L (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C522S090000, C522S111000, C522S112000, C522S113000, C522S114000, C522S120000, C522S121000, C522S150000, C522S152000, C522S153000, C522S173000, C522S174000, C522S178000, C522S182000, C428S3550CN, C428S3550AC, C428S3550EN, C428S423100, C428S500000, C428S508000, C428S516000, C428S207000, C428S208000

Reexamination Certificate

active

10513125

ABSTRACT:
The present invention relates to a free-radically radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive, the precursor comprising: (i) 30-75 wt. % of one or more mono(meth)acrylate functional oligomer compounds at least one of said oligomer compounds comprising at least one urethane bond, (ii) 0-15 wt % of one or more poly(meth)acrylate functional oligomer compounds, (iii) 5-45 wt. % of one or more monomer compounds comprising one ethylenically unsaturated group, (iv) 0-5 wt. % of one or more monomer compounds comprising two or more ethylenically unsaturated groups, and (v) an effective amount of one or more free radical photoinitiators, wherein the percentages which are percentages by weight with respect to the mass of the precursor, are selected so that the precursor has a dynamic viscosity at 20° C. and at a shear rate of 100 s−1of between 300 to 15,000 mPa·s.

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