Frangible semiconductor wafer dicing method which employs scribi

Details Frangible semiconductor wafer dicing method which employs scribi Frangible semiconductor wafer dicing method which employs scribi

1995-01-24

1995-10-17

Peterson, Kenneth E.

Severing by tearing or breaking

Methods

With preliminary weakening

225 5, 225 965, B65H 3510

Patent

active

054582695

ABSTRACT:
A method for applying a controlled, adjustable strain and strain rate by use of a break wheel to break a frangible semiconductor wafer around previously placed scribe lines formed along a surface of the wafer. Several embodiments of a break wheel are disclosed. One embodiment uses a pair of spaced profiles engageable on opposite sides of a scribe line on the wafer. Another embodiment uses three laterally spaced contact profiles, the center profile having a smaller radius than that of the two flanking contact profiles. Another embodiment uses a complaint break wheel for applying a resilient breaking force to the wafer in a region straddling the scribe line. All embodiments are used with a tilted surface having a break edge with which the scribe line is aligned prior to the application of the breaking force. The tilted surface is adjustable to provide a variable maximum strain limit.

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