Frangible semiconductor wafer dicing apparatus which employs scr

Severing by tearing or breaking – Breaking or tearing apparatus – Combined with preliminary weakener or with nonbreaking cutter

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225 97, B26D 727

Patent

active

057852251

ABSTRACT:
A breaking device for separating a substrate along a scribe line formed in a surface of the substrate and spaced a predetermined distance D from a previously formed scribe line. The breaking device comprises a body member and a pair of laterally spaced annular profile members carried by the body member, the profile members each having a wall structure terminating in the contact surface. The amount of lateral spacing between the profile members is substantially equal to ND, where N is an integer, so that the contact surfaces of the pair of profile members are arranged for surface contact with a substrate on opposite sides of the scribe line, with one of the contact surfaces positioned adjacent the previously formed scribe line. An alternate embodiment includes an additional profile member carried by the body member and positioned between the pair of profile members to provide either equidistant positioning or offset positioning of the contact surface of the additional profile member with respect to the scribe line.

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