Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-11-07
2006-11-07
Thompson, Greg (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080400, C361S690000, C361S699000
Reexamination Certificate
active
07133283
ABSTRACT:
A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
REFERENCES:
patent: 4867235 (1989-09-01), Grapes et al.
patent: 4994937 (1991-02-01), Morrison
patent: 5289694 (1994-03-01), Nordin
patent: 5504924 (1996-04-01), Ohashi et al.
patent: 5528454 (1996-06-01), Niklos
patent: 5619486 (1997-04-01), Uno et al.
patent: 5673029 (1997-09-01), Behl et al.
patent: 5731954 (1998-03-01), Cheon
patent: 6021049 (2000-02-01), Thompson et al.
patent: 6088223 (2000-07-01), Diemunsch
patent: 6115251 (2000-09-01), Patel et al.
patent: 6118654 (2000-09-01), Bhatia
patent: 6141211 (2000-10-01), Strickler et al.
patent: 6166907 (2000-12-01), Chien
patent: 6337794 (2002-01-01), Agonafer et al.
patent: 6351381 (2002-02-01), Bilski et al.
patent: 6366461 (2002-04-01), Pautsch et al.
patent: 6473297 (2002-10-01), Behl et al.
patent: 6496364 (2002-12-01), Medin et al.
patent: 6643132 (2003-11-01), Faneuf et al.
patent: 6690575 (2004-02-01), Banton et al.
patent: 6693797 (2004-02-01), Faneuf et al.
patent: 6796372 (2004-09-01), Bear
patent: 2002/0149909 (2002-10-01), Konstad et al.
patent: 0 580 412 (1994-01-01), None
De Lorenzo David S.
Faneuf Barrett M.
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Thompson Greg
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