Frame level partial cooling boost for drawer and/or node...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C062S259200, C174S015100, C165S080300, C165S080400, C165S122000, C165SDIG119, C165SDIG119, C454S184000, C361S695000, C361S699000

Reexamination Certificate

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06970355

ABSTRACT:
A hybrid cooling system is provided which is particularly useful for cooling electronic circuit components disposed on circuit boards arranged in a plurality of drawers within a cabinet or frame. Air cooling is provided locally with a supplementary, auxiliary, or secondary cooling system being provided at more distant frame level locations. This configuration permits optimal sizing of the respective hybrid cooling system components without negatively impacting the coefficient of performance (COP). Hybrid heat sinks are employed to accommodate the hybrid cooling system design.

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RD 261037, dated Jan. 10, 1986 (abstract only).

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