FPD encapsulation apparatus and method for encapsulating the...

Details FPD encapsulation apparatus and method for encapsulating the... FPD encapsulation apparatus and method for encapsulating the...

2006-11-14

2006-11-14

Rossi, Jessica (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With means applying wave energy or electrical energy...

C156S381000, C156S382000, C445S070000, C445S073000

Reexamination Certificate

active

07135090

ABSTRACT:
An FPD encapsulation apparatus at least comprises a chamber and a pressing mechanism. In this case, the chamber has an airtight space to provide a low-pressure environment, and the low-pressure environment is located inside the airtight space. The pressing mechanism is disposed within the chamber, and the pressing mechanism is operated in the low-pressure environment for pressing a second substrate to bind a first substrate and the second substrate. Furthermore, a method for encapsulating an FPD is disclosed. The method comprises providing a first substrate, forming an adhesive on the first substrate, providing a second substrate to align the first substrate and face to the adhesive, providing a low-pressure environment for the first and second substrates, and binding the first and second substrates to form the FPD.

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