Four-way lead flat package IC-mount printed circuit board,...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S736000, C361S720000

Reexamination Certificate

active

07405945

ABSTRACT:
A four-way lead flat package IC-mount printed circuit board, carrying a four-way lead flat package IC and having front soldering land groups placed in front of the four way lead flat package IC and rear soldering land groups placed in the rear of the four-way lead flat package IC, has solder drawing lands, in a neighboring area, between the front soldering land groups and the rear soldering land groups adjacent to the front soldering land groups, and/or a trailing area of the rear soldering land groups. The solder drawing lands are formed with slits substantially parallel to the lines of soldering lands of the front soldering land groups or the rear soldering land groups placed in front of the solder drawing lands. These result in an advantageous effect of enabling the prevention of the occurrence of soldering bridges and soldering residues in the front soldering land groups or the rear soldering land groups.

REFERENCES:
patent: 6998861 (2006-02-01), Nakai et al.
patent: 7075016 (2006-07-01), Lee et al.
patent: 2007/0006610 (2007-01-01), Kawasaki
patent: 38 43 191 (1990-03-01), None
patent: 195 41 340 (1997-05-01), None
patent: 196 09 877 (1997-09-01), None
patent: 05-136551 (1993-06-01), None
patent: 5-315733 (1993-11-01), None
patent: 8-250844 (1996-09-01), None
patent: 2635323 (1997-04-01), None
patent: 2001-352159 (2001-12-01), None
patent: 2002-329955 (2002-11-01), None
patent: 2005-175186 (2005-06-01), None

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