Four-motion wire bonder

Details Four-motion wire bonder Four-motion wire bonder

1982-08-24

1985-11-05

Ramsey, Kenneth J.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 62, 2281802, B23K 3702, H01L 21607

Patent

active

045508712

ABSTRACT:
A four-motion wire bonding apparatus, for effecting wire bonds between a semiconductor chip and a lead frame. In addition to employing X-, Y-, Z- and theta-motion drives for the bonding head, the apparatus provides a bulk wire-feed, which delivers bonding wire along the theta-rotation axis.

REFERENCES:
patent: 3515844 (1970-06-01), Colarossi et al.
patent: 3960309 (1976-06-01), Hazel
patent: 4031612 (1977-06-01), Nicolas
patent: 4053096 (1977-10-01), Heim
patent: 4188525 (1980-02-01), Merrick et al.
patent: 4361261 (1982-11-01), Elles et al.

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