Metal treatment – Compositions – Heat treating
Patent
1975-04-30
1977-07-26
Ozaki, G.
Metal treatment
Compositions
Heat treating
148175, 148187, 148 33, H01L 2126
Patent
active
040381064
ABSTRACT:
A method for making a four-layer P+PNN+ or N+NPP+ diode, and the diode, wherein the impurity profile about the PN junction is optimally graded for TRAPATT operation throughout the span of the avalanche region by ion implantation of the impurities to a depth of 1000A in a semiconductor wafer and wherein these impurities are subsequently thermally diffused.
REFERENCES:
patent: 3638300 (1972-02-01), Foxhall et al.
patent: 3660171 (1972-05-01), Tsuchimoto et al.
patent: 3745070 (1973-07-01), Yada et al.
patent: 3758875 (1973-09-01), Hayashi
patent: 3891468 (1975-06-01), Ito et al.
patent: 3926693 (1975-12-01), Kawamoto et al.
Christoffersen H.
Muckelroy William L.
Ozaki G.
RCA Corporation
Williams Robert P.
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