Forming vias through multilayer circuit boards

Details Forming vias through multilayer circuit boards Forming vias through multilayer circuit boards

1978-12-14

1981-03-31

Husar, Francis S.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, 427 97, H05K 336

Patent

active

042584680

ABSTRACT:
A via (21) is formed in a multilayer printed circuit board (10) by initially etching apertures (14) in the land areas (13) of the circuit pattern on the layers (11) prior to uniting the layers. A beam (16) of laser energy is then directed through the apertures to form a via through the printed circuit board. Each via is defined by the apertures in a plurality of vertically aligned land areas. The via is then electrolessly plated to provide electrical connections between vertically aligned land areas.

REFERENCES:
patent: 3562009 (1971-02-01), Cranston et al.
patent: 3672986 (1972-06-01), Schneble, Jr. et al.
IBM Tech. Discl. Bull., vol. 8, No. 3, Aug. 1965, pp. 419, 434.
Am. Ceram. Soc. Bull., vol. 50, No. 3, 1971, p. 251ff.
IBM Technical Disl., vol. 9, No. 12 (5/67), p. 1679.

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